Teknik Material dan Metalurgi

INSTITUT TEKNOLOGI KALIMANTAN KOTA BALIKPAPAN - KALIMANTAN TIMUR, ID CODE PRODI : 27201 CODE PT : 002013
14
Authors
5.151
SINTA Score Overall
2.613
SINTA Score 3Yr
396
SINTA Score Overall Productivity
201
SINTA Score 3Yr Productivity
Latest number of publications
Electrochemical behaviour of amodiaquine detection using boron doped diamond electrodes
Q3 Journal International Journal of Electrochemical Science
Creator : Ramadhan M.R.
2025 1 cited
Phase equilibria and thermodynamics assessment of the Co–Fe–Nb ternary system
Q1 Journal Intermetallics
Creator : Hutabalian Y.
2024 0 cited
Physical characteristics of developed hybrid briquettes from palm kernel shells/wood sawdust/coffee grounds blends as an alternative energy source
Q4 Journal AIP Conference Proceedings
Creator : Salim A.
2024 0 cited
Study of quinine hydrochloride detection using boron-doped diamond electrodes
Q3 Journal International Journal of Electrochemical Science
Creator : Leoriza M.D.
2024 2 cited
Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe (C19210) Substrates in Molten Sn-9 wt.%Zn Solder
Q2 Journal JOM
Creator : Laksono A.D.
2024 1 cited
Influence of sintering temperature on the tetragonal structure of BaPb0.7Bi0.3O3
Q4 Journal AIP Conference Proceedings
Creator : Lusiana
2024 0 cited
Solid/Solid Interfacial Reactions in the Sn/C7025 and Sn-3.0 wt%Ag-0.5wt%Cu/C7025 Couples
no-Q Journal 2024 International Conference on Electronics Packaging, ICEP 2024
Creator : Chou J.T.
2024 0 cited
Corrosion Behavior of Fe-Ni Bainitic Steel Through an Inverted Austempering Multi-Step Process for Weathering Steel Applications
Q3 Journal Corrosion Science and Technology
Creator : Rohmah M.
2024 0 cited
Solid/solid state interfacial reactions in the lead-free solders/Cu- 2.3%wt. Fe alloy (C194) couples
Q1 Journal Journal of the Taiwan Institute of Chemical Engineers
Creator : Yen Y.W.
2024 0 cited
Interfacial Reactions in the Sn-3.0 wt.%Ag-0.5 wt.% Cu (SAC)/Cu-Ni-Si-Mg Alloy (C7025) Couples
no-Q Journal 2024 International Conference on Electronics Packaging, ICEP 2024
Creator : Ramadhani M.
2024 0 cited
View more ...
Get More with SINTA Insight
Go to Insight
Article Quartile
Research Output
  Scopus GScholar WOS
Article 79 265 24
Citation 265 692 81
Get More with SINTA Insight

Go to Insight