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ANDROMEDA DWI LAKSONO

Institut Teknologi Kalimantan S1 - Teknik Material dan Metalurgi SINTA ID : 6196489
1.001
SINTA Score Overall
561
SINTA Score 3Yr
0
Affil Score
0
Affil Score 3Yr
Latest number of publications
  Scopus Analysis  

Dissolution Behavior of Cu-0.1wt.% Fe C19210 in Molten Sn & SAC305 Solders
no-Q Journal 2024 International Conference on Electronics Packaging, ICEP 2024
Author Order : 1 of 3     Creator : Laksono A.D.
2024 0 cited
Bi Segregation in the Solid/Liquid Cu-0.1 wt.% Fe (C19210)/Sn-58Bi Solder
no-Q Journal 2024 International Conference on Electronics Packaging, ICEP 2024
Author Order : 1 of 3     Creator : Laksono A.D.
2024 0 cited
Interfacial Reactions in the Sn-3.0 wt.%Ag-0.5 wt.% Cu (SAC)/Cu-Ni-Si-Mg Alloy (C7025) Couples
no-Q Journal 2024 International Conference on Electronics Packaging, ICEP 2024
Author Order : 2 of 4     Creator : Ramadhani M.
2024 0 cited
Solid/Solid Interfacial Reactions in the Sn/C7025 and Sn-3.0 wt%Ag-0.5wt%Cu/C7025 Couples
no-Q Journal 2024 International Conference on Electronics Packaging, ICEP 2024
Author Order : 2 of 3     Creator : Chou J.T.
2024 0 cited
Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe (C19210) Substrates in Molten Sn-9 wt.%Zn Solder
Q2 Journal JOM
Author Order : 1 of 4     Creator : Laksono A.D.
2024 1 cited
Solid/solid state interfacial reactions in the lead-free solders/Cu- 2.3%wt. Fe alloy (C194) couples
Q1 Journal Journal of the Taiwan Institute of Chemical Engineers
Author Order : 2 of 6     Creator : Yen Y.W.
2024 0 cited
Phase equilibria and thermodynamics assessment of the Co–Fe–Nb ternary system
Q1 Journal Intermetallics
Author Order : 3 of 4     Creator : Hutabalian Y.
2024 0 cited
Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) couple
Q2 Journal Soldering and Surface Mount Technology
Author Order : 1 of 3     Creator : Laksono A.D.
2024 0 cited
Mechanical Properties of Polypropylene Composites with Different Reinforced Natural Fibers – A Comparative Study
Q2 Journal Journal of Ecological Engineering
Author Order : 4 of 4     Creator : Simamora P.
2023 1 cited
Investigation of the Interfacial Reactions between the CoCuFeNi High Entropy Alloy and Sn Solder
Q1 Journal Metals
Author Order : 4 of 5     Creator : Chiang T.Y.
2023 1 cited
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Summary

Article Quartile
Research Output
  Scopus GScholar WOS
Article 28 69 6
Citation 65 214 23
Cited Document 17 43 4
H-Index 4 8 3
i10-Index 2 5 1
G-Index 2 1 3
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